Differences

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--- ion_beam_etcher [2018/07/17 10:13] – [When done] scholma
+++ ion_beam_etcher [2025/05/19 14:18] (current) – [When done] wigbout
@@ Line 5: / Line 5: @@
 processing typically low energies are used to avoid damage to the imaging resist.
-The system is equipped with a loadlock with a (sputtering gun, removed jan 2012) knudsen cell so that a deposition step
+The system is equipped with a loadlock with a knudsen cell so that a deposition step
 can be performed immediately after etching (a so called self aligned process).
 The substrate table can be tilted and can rotate in the tilt plane.
 ====== Manual Ion beam etcher ======
-Change the input source on the display to VGA if it isn't on the correct input source.
+Change the input source on the display to DisplayPort if it isn't on the correct input source.\\
+Switch over USB cables of mouse and keyboard.
-Make sure shutter is not in contact with sample holder when starting the process!
 ===== Mounting sample on holder =====
@@ Line 44: / Line 44: @@
   * Set MFC setpoint to 0 with the software.
   * Set valve override to OFF. You're now able to write a setpoint to the MFC.
-  * Slowly increase setpoint in steps of 5% to pump away left over Ar in the line. Open MFC fully (valve override OPEN) when pressure doesn't increase anymore.
+  * Slowly increase setpoint in steps of 5% to pump away left over Ar in the line. Open MFC fully (100%) when pressure doesn't increase anymore.
-  * Put valve override to 'OFF' and put the setpoint to 0.
+  * Put the setpoint to 0 and put valve override to 'OFF'.
   * Wait (~30 mins) until pressure is <1.0e-5.
@@ Line 57: / Line 57: @@
   * Cool with N<sub>2</sub> if needed (Resist can become too hard to remove if not cooled, especially if you etch longer than 4 min).
-    * {{images:n2barrel.png}}
     * Check if N<sub>2</sub> barrel needs to be refilled.
     * Attach Hose
@@ Line 92: / Line 91: @@
 ===== When done =====
-  * Let ion gun cool by increasing Ar flow (1e-2 mbar, 2 min)
+  * Let ion gun cool by increasing Ar flow such that the pressure is at 1e-2 mbar (typically MFC: 20%) for about 2 min.
   * If you cooled your sample, let the sample warm up for at least 15 min (08-04-21: Or do 5 min and do another 10 mins at 1 bar) while pumping (this to avoid possible pollution of oil or other things on your priceless sample).
   * Close green Argon valve.
@@ Line 102: / Line 101: @@
   * Vent the system slowly with the "vent" switch (start with 1 sec)
   * Wait until turbo pump has decelerated
-  * If you cooled with N<sub>2</sub>, you need to let your sample stay inside the lock at close to 1 bar (~10 mins) to let the sampleholder warm up. As long as it is below 0, Ice may form, once you remove it.
+  * If you cooled with N<sub>2</sub>, you need to let your sample stay inside the lock at close to 1 bar (~10 mins) to let the sample holder warm up. As long as it is below 0, Ice may form, once you remove it.
   * Remove sample holder
   * Pump chamber down for a few minutes with rotation pump (no turbo).
-  * Remove sample, clean sample holder with acetone and IPA.
+  * Turn on the Turbo (TP switch)
+  * Remove sample, clean sample holder with Silver paint dilutent, acetone and/or IPA.
   * Fill in the logbook