plasmalab_90
Differences
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| plasmalab_90 [2018/05/29 11:54] – [Etching rates] scholma | plasmalab_90 [2018/06/08 07:06] (current) – [Description] scholma | ||
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| The system has a loadlock and fully automated loading/ | The system has a loadlock and fully automated loading/ | ||
| - | Current configuration: Fluorine etcher, SF6, CF4, O2, Ar, N2. | + | ==== Current |
| + | * SF6 | ||
| + | * CF4 | ||
| + | * O2 | ||
| + | * Ar | ||
| + | * CHF3 | ||
| + | * empty slot | ||
| ====== Manual PlasmaLab 90+ ====== | ====== Manual PlasmaLab 90+ ====== | ||
| The technical logbook can be found [[PlasmaLab 90+ logbook|here]] | The technical logbook can be found [[PlasmaLab 90+ logbook|here]] | ||
plasmalab_90.1527594863.txt.gz · Last modified: 2018/05/29 11:54 by scholma