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====== Description ======

====== Manual ======

===== Sample Loading =====
  - Lift the top plate and remove the glass cylinder. Take care that the top-plate does not fall forward. The target can be damaged by striking the sample table.
  - Place your sample, mounted on a stub, on the stage.
  - Unlock the tilt lever of the stage.
  - Set tilt at desired angle and lock the tilt lever again.
  - If a thickness controlled process will be used change the angle of the thickness crystal so that it faces towards the sputter target.
  - Check that the stage isn't hindered by the wire of the thickness crystal by letting the stage rotate at the desired speed.
  - Replace glass cylinder and gently lower the top plate. Check that the top plate sits correctly on the glass cylinder.
  - Turn on the system and allow the system to pump to better than 0,01 mbar and then wait for another 5 minutes.

===== Automatic Controlled Process =====
==== Pre-Sputtering ====
   - Select Auto with the auto/manual button.
   - Select timer.
   - Set pre-sputtering time at 10 seconds by holding PAUSE/TEST and pressing the timer SET buttons.
   - Set pre-sputter current to desired value by holding the SET mA button and pressing the timer SET buttons. Available currents 20, 40, 60, and 80 mA.
   - Make sure the shutter is closed
   - Press CYCLE/STOP to start pre-sputering process. The system will proceed through its standard cycle.

==== Sputtering ====
   - Select timer for a timed process or MTM for a thickness controlled process.
        - Timed process, Change sputtering time by holding PAUSE/TEST and pressing the timer SET buttons. Time can be set between 5 and 300 seconds.
        - Thickness controlled process
             - Turn on the thickness monitor (MTM 20)
             - Set the correct density according to the target material by pressing the DENSITY button once and find the correct setting by scrolling with the scroll buttons.
             - Set the correct tooling factor according to stage tilt by pressing the TOOLING button once and find the correct setting by scrolling with the scroll buttons.
             - Set desired coating thickness by holding the TERMINATOR button for one second. The value for the thickness will show up and can be adjusted with the scroll buttons. 
   - Set sputter current to desired value by holding the SET mA button and pressing the timer SET buttons. Available currents 20, 40, 60, and 80 mA.
   - Set roatating speed of stage at desired value.
   - Open shutter
   - Press CYCLE/STOP to start the sputtering process. The system will proceed through its standard cycle.
  - After sputtering note the final thickness for a thickness controlled process.
  - Close shutter.

==== When Done ====
   - Switch off the system to automatically vent the chamber, which will take approximately 2 minutes.
   - Lift the top plate and remove the glass cylinder.
   - Set tilt of the stage to the horizontal position.
   - Remove your sample.
   - Clean inside of the glass cylinder with a tissue and ethanol to keep the glass clear.
   - Replace glass cylinder and gently lower the top plate. Leave the system vented.

===== Manual process for Cr-sputtering =====
   - Select manual with the auto/manual button.
   - Select timer for a timed process or MTM for a thickness controlled process.
        - Timed process, Change sputtering time by holding PAUSE/TEST and pressing the timer SET buttons. Time can be set between 5 and 300 seconds.
        - Thickness controlled process
             - Turn on the thickness monitor (MTM 20)
             - Set the correct density according to the target material by pressing the DENSITY button once and find the correct setting by scrolling with the scroll buttons.
             - Set the correct tooling factor according to stage tilt by pressing the TOOLING button once and find the correct setting by scrolling with the scroll buttons.
             - Set desired coating thickness by holding the TERMINATOR button for one second. The value for the thickness will show up and can be adjusted with the scroll buttons.
   - Set sputter current to 80 mA by holding the SET mA button and pressing the timer SET buttons.
   - Set rotating speed of stage at desired value.
   - Open argon flush valve for 10 seconds, then close.
   - Pump to 0,001 mbar
   - Open argon flush valve for 3 seconds, then close
   - Open leak valve.
   - When pressure reaches better than 0,03 mbar set MTM-20 to ZERO for a thickness controlled process
   - Press START/STOP to start sputtering
   - Initially the discharge will be pink of colour. It will turn blue when the surface layer of chromium oxide is removed and chromium begins toe sputter.
   - When plasma turns blue open the shutter
   - After sputtering note the final thickness for a thickness controlled process.
   - Close shutter.

====== Available Targets ======
^  Target Material  ^  Atomic Number  ^  Density in g/cm³  ^
|  Pt/Pd (80/20)  |  78/46  |  19,52  |
|  Cr  |  24  |  7,19  |
|  Ir  |  77  |  22,56  |


====== Deposition Rates ======

^  Target Material  ^ Date  ^  User  ^  Tilt  ^   Current  ^  Time  ^  Measurement  ^  Result  ^  Rate  ^
|  Pt/Pd (80/20)  |    |    |    |  40 mA  |    |    |    |    |
|  Cr  |    |    |    |  80 mA  |    |    |    |    |
|  Ir  |    |    |    |  40 mA  |    |    |    |    |