====== NanoLab facilities ======

==== Sputtering ====
   * FIXME [[UHV system|UHV]] (4-magnetron targets, incl. loadlock)
   * FIXME [[Z-400|Z-406]] (3-target diode sputtering system)
   * FIXME [[Z-407|Z-407]] (3-target diode sputtering system)
   * FIXME [[oxides system|Off-axis]] (4-source, reactive sputtering for the epitaxial growth of perovskites)
   * FIXME [[ATC-1800]] (4-source AJA, with substrate heating, cooling and RF bias, reactive sputtering of ZrN, NbTiN, incl. loadlock)
   * FIXME [[Cressington 208HR|Cressington sputter coater]] (for SEM)

   * These are the available [[targets]]

==== Evaporation ====
   * [[Resistance evaporator manual|Resistance evaporator]]
   * [[E-beam evaporator#manual|E-beam evaporator]] (incl. instructions for users)
   * FIXME [[K-Cell evaporator#manual|K-cell evaporator]] (OoO)



==== Preparation ====
   * Laminar Flow Unit (HL 603)
   * Fumehood (HL 603) (for heating liquids and wet cleaning processes)
   * FIXME Carbon coater


===== Annealing =====
   * FIXME [[Thermcraft Tube Oven#manual|Tube Oven - H2, Ar and Vacuum Annealing]]
   * FIXME [[Lindberg/Blue tube oven#manual|Tube Oven - O2 and Ar Annealing]]

===== Lithography =====
   * [[Resist and e-beam recipes|Resist recipes]]
   * FIXME [[SPIN150i POLOS spin coater|Spin coater POLOS SPIN150i]]
   * [[EBPG Raith-100|Electron Beam Lithography (Raith EBPG)]] with laser stage is the main workhorse nowadays, it routinely writes 50 nm lines in PMMA, 3 sigma overlay and stitch accuracy are below 80 nm.

===== Etching =====
   * FIXME [[PlasmaLab 90+|PlasmaLab]] RIE etcher (fluorine etcher, SF6, CF4, O2, Ar)
   * FIXME [[ion beam etcher|Ion Beam Etcher]] for dry etching (Ar) (can do CAIBE)
   * Wetbench in the clean room for development and wet etching
   * Fume hood for the use of strong acids (HL 607)




===== Analysis and inspection =====
   * FIXME [[Thermofisher ApreoSEM|ApreoSEM Thermofisher]]
   * FIXME [[Nikon ECLIPSE LV150 optical microscope |Nikon LV150 optical microscope]]
   * FIXME [[Bruker DektakXT profilometer|Bruker DektakXT profilometer]]
   * [[afm film morphology|AFM/STM Film Morphology]]


   * AFM for measuring surface topography of films and structures, MFM, EFM etc.
   * The group has a low angle X-ray diffraction system [[Siemens D5005]] that can   measure the crystal structure (if any) and thickness of thin films
   * Quantum Design [[MPMS]]-5S (Magnetic Properties Measurement System) and [[PPMS]] (Physical Properties Measurement System) 

===== Sample mounting =====
   * [[Wire bonder|Wirebonder]] for bonding Al wire

===== Utility =====
   * [[Dishwasher cleanroom|Dishwasher cleanroom]]


===== Computing =====
   * Raith E_line for e-beam structure design at the e-beam and in 626
   * Rump in 626 for RBS spectrum simulation
   * Specon in 614 for Ortec channel data to RUMP conversion
   * Sputsim for MC/MD simulation of magnetron sputtering / liftoff processes
   * Casino in 626 for MC simulation of electrons in resists/substrates
   * SRIM / TRIM (SP) / FRACTAL TRIM in 626 for MC simulation of RBS and sputtering