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Description

Manual

Lift the top plate and remove the glass cylinder. Take care that the top-plate does not fall forward. The target can be damaged by striking the sample table.
Place your sample, mounted on a stub, on the stage.
Unlock the tilt lever of the stage.
Set tilt at desired angle and lock the tilt lever again.
If a thickness controlled process will be used change the angle of the thickness crystal so that it faces towards the sputter target.
Check that the stage isn't hindered by the wire of the thickness crystal by letting the stage rotate at the desired speed.
Replace glass cylinder and gently lower the top plate. Check that the top plate sits correctly on the glass cylinder.
Turn on the system and allow the system to pump to better than 0,01 mbar and then wait for another 5 minutes.

Select Auto with the auto/manual button.
Select timer.
Set pre-sputtering time at 10 seconds by holding PAUSE/TEST and pressing the timer SET buttons.
Set pre-sputter current to desired value by holding the SET mA button and pressing the timer SET buttons. Available currents 20, 40, 60, and 80 mA.
Make sure the shutter is closed
Press CYCLE/STOP to start pre-sputering process. The system will proceed through its standard cycle.

Select timer for a timed process or MTM for a thickness controlled process.
1. Timed process, Change sputtering time by holding PAUSE/TEST and pressing the timer SET buttons. Time can be set between 5 and 300 seconds.
2. Thickness controlled process
  1. Turn on the thickness monitor (MTM 20)
  2. Set the correct density according to the target material by pressing the DENSITY button once and find the correct setting by scrolling with the scroll buttons.
  3. Set the correct tooling factor according to stage tilt by pressing the TOOLING button once and find the correct setting by scrolling with the scroll buttons.
  4. Set desired coating thickness by holding the TERMINATOR button for one second. The value for the thickness will show up and can be adjusted with the scroll buttons.
Set sputter current to desired value by holding the SET mA button and pressing the timer SET buttons. Available currents 20, 40, 60, and 80 mA.
Set roatating speed of stage at desired value.
Open shutter
Press CYCLE/STOP to start the sputtering process. The system will proceed through its standard cycle.
After sputtering note the final thickness for a thickness controlled process.
Close shutter.

Switch off the system to automatically vent the chamber, which will take approximately 2 minutes.
Lift the top plate and remove the glass cylinder.
Set tilt of the stage to the horizontal position.
Remove your sample.
Clean inside of the glass cylinder with a tissue and ethanol to keep the glass clear.
Replace glass cylinder and gently lower the top plate. Leave the system vented.