Differences

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--- facilities [2007/01/19 13:20] – hendrikx
+++ facilities [2025/07/29 10:16] (current) – [Analysis and inspection] wigbout
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+====== NanoLab facilities ======
+==== Sputtering ====
+   * FIXME [[UHV system|UHV]] (4-magnetron targets, incl. loadlock)
+   * FIXME [[Z-400|Z-406]] (3-target diode sputtering system)
+   * FIXME [[Z-407|Z-407]] (3-target diode sputtering system)
+   * FIXME [[oxides system|Off-axis]] (4-source, reactive sputtering for the epitaxial growth of perovskites)
+   * FIXME [[ATC-1800]] (4-source AJA, with substrate heating, cooling and RF bias, reactive sputtering of ZrN, NbTiN, incl. loadlock)
+   * FIXME [[Cressington 208HR|Cressington sputter coater]] (for SEM)
+   * These are the available [[targets]]
+==== Evaporation ====
+   * [[Resistance evaporator manual|Resistance evaporator]]
+   * [[E-beam evaporator#manual|E-beam evaporator]] (incl. instructions for users)
+   * FIXME [[K-Cell evaporator#manual|K-cell evaporator]] (OoO)
+==== Preparation ====
+   * Laminar Flow Unit (HL 603)
+   * Fumehood (HL 603) (for heating liquids and wet cleaning processes)
+   * FIXME Carbon coater
+===== Annealing =====
+   * FIXME [[Thermcraft Tube Oven#manual|Tube Oven - H2, Ar and Vacuum Annealing]]
+   * FIXME [[Lindberg/Blue tube oven#manual|Tube Oven - O2 and Ar Annealing]]
+===== Lithography =====
+   * [[Resist and e-beam recipes|Resist recipes]]
+   * FIXME [[SPIN150i POLOS spin coater|Spin coater POLOS SPIN150i]]
+   * [[EBPG Raith-100|Electron Beam Lithography (Raith EBPG)]] with laser stage is the main workhorse nowadays, it routinely writes 50 nm lines in PMMA, 3 sigma overlay and stitch accuracy are below 80 nm.
+===== Etching =====
+   * FIXME [[PlasmaLab 90+|PlasmaLab]] RIE etcher (fluorine etcher, SF6, CF4, O2, Ar)
+   * FIXME [[ion beam etcher|Ion Beam Etcher]] for dry etching (Ar) (can do CAIBE)
+   * Wetbench in the clean room for development and wet etching
+   * Fume hood for the use of strong acids (HL 607)
+===== Analysis and inspection =====
+   * FIXME [[Thermofisher ApreoSEM|ApreoSEM Thermofisher]]
+   * FIXME [[Nikon ECLIPSE LV150 optical microscope |Nikon LV150 optical microscope]]
+   * FIXME [[Bruker DektakXT profilometer|Bruker DektakXT profilometer]]
+   * [[afm film morphology|AFM/STM Film Morphology]]
+   * AFM for measuring surface topography of films and structures, MFM, EFM etc.
+   * The group has a low angle X-ray diffraction system [[Siemens D5005]] that can   measure the crystal structure (if any) and thickness of thin films
+   * Quantum Design [[MPMS]]-5S (Magnetic Properties Measurement System) and [[PPMS]] (Physical Properties Measurement System)
+===== Sample mounting =====
+   * [[Wire bonder|Wirebonder]] for bonding Al wire
+===== Utility =====
+   * [[Dishwasher cleanroom|Dishwasher cleanroom]]
+===== Computing =====
+   * Raith E_line for e-beam structure design at the e-beam and in 626
+   * Rump in 626 for RBS spectrum simulation
+   * Specon in 614 for Ortec channel data to RUMP conversion
+   * Sputsim for MC/MD simulation of magnetron sputtering / liftoff processes
+   * Casino in 626 for MC simulation of electrons in resists/substrates
+   * SRIM / TRIM (SP) / FRACTAL TRIM in 626 for MC simulation of RBS and sputtering