facilities
Table of Contents
NanoLab facilities
Sputtering
UHV (4-magnetron targets, incl. loadlock)- Z-406 (3-target diode sputtering system)
- Z-407 (3-target diode sputtering system)
- Off-axis (4-source, reactive sputtering for the epitaxial growth of perovskites)
- ATC-1800 (4-source AJA, with substrate heating, cooling and RF bias, reactive sputtering of ZrN, NbTiN, incl. loadlock)
- Cressington sputter coater (for SEM)
- These are the available targets
Evaporation
- E-beam evaporator (incl. instructions for users)
- K-cell evaporator (OoO)
Preparation
- Laminar Flow Unit (HL 603)
- Fumehood (HL 603) (for heating liquids and wet cleaning processes)
- Carbon coater
Annealing
Lithography
- Electron Beam Lithography (Raith EBPG) with laser stage is the main workhorse nowadays, it routinely writes 50 nm lines in PMMA, 3 sigma overlay and stitch accuracy are below 80 nm.
Etching
- PlasmaLab RIE etcher (fluorine etcher, SF6, CF4, O2, Ar)
- Ion Beam Etcher for dry etching (Ar) (can do CAIBE)
- Wetbench in the clean room for development and wet etching
- Fume hood for the use of strong acids (HL 607)
Analysis and inspection
- AFM for measuring surface topography of films and structures, MFM, EFM etc.
- The group has a low angle X-ray diffraction system Siemens D5005 that can measure the crystal structure (if any) and thickness of thin films
Sample mounting
- Wirebonder for bonding Al wire
Utility
Computing
- Raith E_line for e-beam structure design at the e-beam and in 626
- Rump in 626 for RBS spectrum simulation
- Specon in 614 for Ortec channel data to RUMP conversion
- Sputsim for MC/MD simulation of magnetron sputtering / liftoff processes
- Casino in 626 for MC simulation of electrons in resists/substrates
- SRIM / TRIM (SP) / FRACTAL TRIM in 626 for MC simulation of RBS and sputtering
facilities.txt · Last modified: 2025/07/29 10:16 by wigbout