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facilities [2011/11/17 10:30] – hesselfacilities [2025/07/29 10:16] (current) – [Analysis and inspection] wigbout
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 ====== NanoLab facilities ====== ====== NanoLab facilities ======
- 
-===== Deposition ===== 
  
 ==== Sputtering ==== ==== Sputtering ====
-   * 4-magnetron [[UHV system|UHV sputtering system]] (loadlock) +   * FIXME [[UHV system|UHV]] (4-magnetron targets, incl. loadlock) 
-   * 3-target Leybold [[Z-400]] diode sputtering system +   * FIXME [[Z-400|Z-406]] (3-target diode sputtering system) 
-   * 4-source reactive [[oxides system]] for the epitaxial growth of Perovskites +   * FIXME [[Z-407|Z-407]] (3-target diode sputtering system) 
-   * 4-source AJA [[ATC-1800]] with substrate heating, cooling and RF bias (loadlock) +   * FIXME [[oxides system|Off-axis]] (4-source, reactive sputtering for the epitaxial growth of perovskites) 
-   * Available [[targets]]+   * FIXME [[ATC-1800]] (4-source AJA, with substrate heating, cooling and RF bias, reactive sputtering of ZrN, NbTiN, incl. loadlock) 
 +   * FIXME [[Cressington 208HR|Cressington sputter coater]] (for SEM) 
 + 
 +   * These are the available [[targets]]
  
 ==== Evaporation ==== ==== Evaporation ====
-   * [[K-cell evaporator]] +   * [[Resistance evaporator manual|Resistance evaporator]] 
-   * UHV multi-crucible [[e-gun evaporator]] for shadow evaporation (loadlock)+   * [[E-beam evaporator#manual|E-beam evaporator]] (incl. instructions for users) 
 +   * FIXME [[K-Cell evaporator#manual|K-cell evaporator]] (OoO)
  
-==== Substrate preparation ==== + 
-   * laminar flow unit in 603 + 
-   * fumehood in 603 for heating liquids and wet cleaning processes +==== Preparation ==== 
-   * Pt-Ir sputtering system for EM specimen preparation +   * Laminar Flow Unit (HL 603) 
-   * Carbon evaporator for EM specimen preparation+   * Fumehood (HL 603) (for heating liquids and wet cleaning processes) 
 +   * FIXME Carbon coater 
 + 
 + 
 +===== Annealing ===== 
 +   * FIXME [[Thermcraft Tube Oven#manual|Tube Oven - H2, Ar and Vacuum Annealing]] 
 +   * FIXME [[Lindberg/Blue tube oven#manual|Tube Oven - O2 and Ar Annealing]]
  
 ===== Lithography ===== ===== Lithography =====
-   * [[Electron beam lithography]], the [[Raith 100 / E-line]] with laser stage is the main workhorse nowadays, it routinely writes 50 nm lines in PMMA, 3 sigma overlay and stitch accuracy are below 80 nm. +   * [[Resist and e-beam recipes|Resist recipes]] 
-   * [[Optical lithography]] is still done+   * FIXME [[SPIN150i POLOS spin coater|Spin coater POLOS SPIN150i]] 
 +   * [[EBPG Raith-100|Electron Beam Lithography (Raith EBPG)]] with laser stage is the main workhorse nowadays, it routinely writes 50 nm lines in PMMA, 3 sigma overlay and stitch accuracy are below 80 nm.
  
 ===== Etching ===== ===== Etching =====
-   * [[PlasmaLab 90+]] RIE etcher (fluorine etcher, SF6, CF4, O2, Ar) +   * FIXME [[PlasmaLab 90+|PlasmaLab]] RIE etcher (fluorine etcher, SF6, CF4, O2, Ar) 
-   * [[ion beam etcher]] for dry etching (can do CAIBE) +   * FIXME [[ion beam etcher|Ion Beam Etcher]] for dry etching (Ar) (can do CAIBE) 
-   * Nanoscale ion milling is done with the dual beam  [[http://dutsm43.stm.tudelft.nl/microscopes/fib.html|SEM/FIB]] at the HREM centre in Delft (400 euro per day) +   * Wetbench in the clean room for development and wet etching 
-   * O<sub>2</sub> [[barrel etcher]] for resist removal and substrate cleaning +   * Fume hood for the use of strong acids (HL 607)
-   * wetbench in the clean room for development and wet etching +
-   * A fume hood for the use of strong acids in 607 +
  
  
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 ===== Analysis and inspection ===== ===== Analysis and inspection =====
-   * [[FEI NanoSEM 200]] scanning electron microscope (BioAFM group) (features a nanotube/wire nanomanipulator, EBID deposition, low vacuum mode, STEM, cryoSEM and many other options) +   * FIXME [[Thermofisher ApreoSEM|ApreoSEM Thermofisher]] 
-   * [[JEOL 820 SEM]] scanning electron microscope +   * FIXME [[Nikon ECLIPSE LV150 optical microscope |Nikon LV150 optical microscope]] 
-   * RBS analysis at [[http://www.amolf.nl|Amolf]] +   * FIXME [[Bruker DektakXT profilometer|Bruker DektakXT profilometer]] 
-   * 120 kV [[Philips EM410]] transmission electron microscope +   * [[afm film morphology|AFM/STM Film Morphology]] 
-   * optical microscopes in the cleanroom and 614 + 
-   * AFM for measuring surface topograpy of films and structures, MFM, EFM etc.+ 
 +   * AFM for measuring surface topography of films and structures, MFM, EFM etc.
    * The group has a low angle X-ray diffraction system [[Siemens D5005]] that can   measure the crystal structure (if any) and thickness of thin films    * The group has a low angle X-ray diffraction system [[Siemens D5005]] that can   measure the crystal structure (if any) and thickness of thin films
    * Quantum Design [[MPMS]]-5S (Magnetic Properties Measurement System) and [[PPMS]] (Physical Properties Measurement System)     * Quantum Design [[MPMS]]-5S (Magnetic Properties Measurement System) and [[PPMS]] (Physical Properties Measurement System) 
  
 ===== Sample mounting ===== ===== Sample mounting =====
-   * [[wire bonder]] for bonding Al and Au wire+   * [[Wire bonder|Wirebonder]] for bonding Al wire 
 + 
 +===== Utility ===== 
 +   * [[Dishwasher cleanroom|Dishwasher cleanroom]] 
  
 ===== Computing ===== ===== Computing =====
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    * Casino in 626 for MC simulation of electrons in resists/substrates    * Casino in 626 for MC simulation of electrons in resists/substrates
    * SRIM / TRIM (SP) / FRACTAL TRIM in 626 for MC simulation of RBS and sputtering    * SRIM / TRIM (SP) / FRACTAL TRIM in 626 for MC simulation of RBS and sputtering
-   * Analysis in 614 for SEM image analysis+
facilities.1321525829.txt.gz · Last modified: 2011/11/17 10:30 by hessel
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