NanoLab facilities

UHV (4-magnetron targets, incl. loadlock)

Z-406 (3-target diode sputtering system)

Z-407 (3-target diode sputtering system)

Off-axis (4-source, reactive sputtering for the epitaxial growth of perovskites)

ATC-1800 (4-source AJA, with substrate heating, cooling and RF bias, reactive sputtering of ZrN, NbTiN, incl. loadlock)

Cressington sputter coater (for SEM)

These are the available targets

Resistance evaporator

E-beam evaporator (incl. instructions for users)

K-cell evaporator (OoO)

Laminar Flow Unit (HL 603)

Fumehood (HL 603) (for heating liquids and wet cleaning processes)

Carbon coater

Tube Oven - H2, Ar and Vacuum Annealing

Tube Oven - O2 and Ar Annealing

Resist recipes

Spin coater POLOS SPIN150i

Electron Beam Lithography (Raith EBPG) with laser stage is the main workhorse nowadays, it routinely writes 50 nm lines in PMMA, 3 sigma overlay and stitch accuracy are below 80 nm.

PlasmaLab RIE etcher (fluorine etcher, SF6, CF4, O2, Ar)

Ion Beam Etcher for dry etching (Ar) (can do CAIBE)

Wetbench in the clean room for development and wet etching

Fume hood for the use of strong acids (HL 607)

ApreoSEM Thermofisher

Nikon LV150 optical microscope

Bruker DektakXT profilometer

AFM/STM Film Morphology

AFM for measuring surface topography of films and structures, MFM, EFM etc.

The group has a low angle X-ray diffraction system Siemens D5005 that can measure the crystal structure (if any) and thickness of thin films

Quantum Design MPMS-5S (Magnetic Properties Measurement System) and PPMS (Physical Properties Measurement System)

Wirebonder for bonding Al wire

Dishwasher cleanroom

Raith E_line for e-beam structure design at the e-beam and in 626

Rump in 626 for RBS spectrum simulation

Specon in 614 for Ortec channel data to RUMP conversion

Sputsim for MC/MD simulation of magnetron sputtering / liftoff processes

Casino in 626 for MC simulation of electrons in resists/substrates

SRIM / TRIM (SP) / FRACTAL TRIM in 626 for MC simulation of RBS and sputtering